This plan is specifically developed for laser welding of electronic devices. Compared to traditional methods, it has the advantages of non-contact operation, minimal thermal deformation, and high welding accuracy.
Specifically, it can avoid physical damage to the device, reduce thermal shock to surrounding components, and ensure welding quality and stability.
In practical applications, parameters will be optimized based on device characteristics and strict quality control will be implemented throughout the entire process.
Through this plan, it can help promote the development of the electronics industry.
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